Witrynamar 2011–jul 2011. Ru is of high interest for future applications. On one hand, Ru serves as a glue layer for Copper (Cu), so it’s a promising material for future interconnects. On the other hand, Ru is a promising candidate as the future electrode material for the DRAM metal-insulator-metal capacitor (MIMCAP), since Ru remains conductive ... WitrynaOther challenges in scaling 2D NAND beyond the 15 nm node include cell-to-cell interference, unscalable dielectrics, and electron leakage [1]. To address these challenges, 3D NAND fundamentally changes the scaling paradigm. Instead of traditional X-Y scaling in a horizontal plane, 3D NAND scales in the Z-direction by stacking …
Ruthenium based materials as electrode materials for
Witryna9 kwi 2024 · Imec has been looking at Ruthenium (Ru) as a replacement for Tungsten (W) for the horizontal word line sheets. With Ru Imec believe they can get to … Witryna20 maj 2024 · We demonstrate the integration of Ruthenium as Word Line metal in a 3-D NAND device by adopting the Replacement Metal Gate (RMG) process. … photo labels for wine bottles
Imec Presents Copper, Cobalt and Ruthenium …
WitrynaAtomic layer deposition of ruthenium is studied as a barrierless metallization solution for future sub-10 nm interconnect technology nodes. We demonstrate the void-free filling in sub-10 nm wide single damascene lines using an ALD process in combination with 2.5 Å of ALD TiN interface and postdeposition annealing. At such small dimensions, the … Witryna17 mar 2024 · However, the demonstration by IMEC shows that these worries can be avoided to create fully-functional active devices down to the 3nm scale. The BPRs developed by IMEC are made from Tungsten (W), and via interconnects to this layer used Ruthenium (Ru). The effectiveness of the BPRs was further displayed after 900 … Witryna1 . Development of Metal Free Wet Etching Chemical for Ruthenium Interconnect . TOK (Tokyo Ohka Kogyo Co., Ltd.), Japan *Takuya Ohashi, Yukihisa Wada, Mai Sugawara, Tomoya Kumagai . IMEC, Belgium Quoc Toan Le, Els Kesters, Yusuke Oniki, Jens Rip, Frank Holsteyns how does hiccuping work